Skip to content

https://imptron.com

Technical Capabilities

•  Independently controlled hot and cold zones
•  Automated specimen transfer
•  Vertical and horizontal transfer configurations
•  Programmable dwell periods and cycle sequences
•  Product temperature monitoring
•  Two-zone and three-zone air-to-air configurations

Temperature limits, transfer time and recovery performance depend on the selected configuration, specimen load and test requirements.

Applicable Standards

Depending on the selected configuration and test procedure:

•  IEC 60068-2-14 — Change of temperature
•  MIL-STD-810, Method 503 — Temperature shock
•  MIL-STD-883, Method 1010 — Temperature cycling
•  JESD22-A104 — Temperature cycling
•  IEC 60749-11 — Rapid change of temperature
•  Customer-specific OEM requirements

The chamber configuration must be matched to the required test method, exposure conditions and specimen load.

Key Features

•  Rapid hot-to-cold and cold-to-hot transitions
•  Independent temperature-zone control
•  Automated transfer and programmable cycling
•  Cascade refrigeration and electric heating
•  Automatic defrost management
• Independent temperature safety limits
•  Door and transfer-system interlocks
•  Alarm diagnostics, data logging and reporting

Available features depend on configuration.

Options

•  Product thermocouples
•  Additional access ports
•  Product power supply
•  Liquid-nitrogen-assisted cooling
•  Nitrogen purging with flow meter
•  Product protection interlocks
•  Custom test baskets and fixtures

Control & Instrumentation

IMPTRON NEXUS combines multi-zone temperature control, test programming and data management through a 7-inch colour touchscreen.

Supports up to 100 test programs, programmable dwell and cycle sequences, real-time monitoring, trend graphs and password-protected user access.

Automatic PDF reporting, USB and FTP data export, and VNC remote monitoring and control are available according to configuration.

Applications

•  Automotive and EV electronics
•  Sensors, connectors and power electronics
•  PCBs, semiconductor devices and IC packages
•  Aerospace and defence electronic assemblies
•  Battery components
•  Materials, seals and industrial assemblies