This is a demo store for testing purposes — no orders shall be fulfilled. Dismiss
This is a demo store for testing purposes — no orders shall be fulfilled. Dismiss
• Independently controlled hot and cold zones
• Automated specimen transfer
• Vertical and horizontal transfer configurations
• Programmable dwell periods and cycle sequences
• Product temperature monitoring
• Two-zone and three-zone air-to-air configurations
Temperature limits, transfer time and recovery performance depend on the selected configuration, specimen load and test requirements.
Depending on the selected configuration and test procedure:
• IEC 60068-2-14 — Change of temperature
• MIL-STD-810, Method 503 — Temperature shock
• MIL-STD-883, Method 1010 — Temperature cycling
• JESD22-A104 — Temperature cycling
• IEC 60749-11 — Rapid change of temperature
• Customer-specific OEM requirements
The chamber configuration must be matched to the required test method, exposure conditions and specimen load.
• Rapid hot-to-cold and cold-to-hot transitions
• Independent temperature-zone control
• Automated transfer and programmable cycling
• Cascade refrigeration and electric heating
• Automatic defrost management
• Independent temperature safety limits
• Door and transfer-system interlocks
• Alarm diagnostics, data logging and reporting
Available features depend on configuration.
• Product thermocouples
• Additional access ports
• Product power supply
• Liquid-nitrogen-assisted cooling
• Nitrogen purging with flow meter
• Product protection interlocks
• Custom test baskets and fixtures
IMPTRON NEXUS combines multi-zone temperature control, test programming and data management through a 7-inch colour touchscreen.
Supports up to 100 test programs, programmable dwell and cycle sequences, real-time monitoring, trend graphs and password-protected user access.
Automatic PDF reporting, USB and FTP data export, and VNC remote monitoring and control are available according to configuration.
• Automotive and EV electronics
• Sensors, connectors and power electronics
• PCBs, semiconductor devices and IC packages
• Aerospace and defence electronic assemblies
• Battery components
• Materials, seals and industrial assemblies
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